For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard.
At the heart of this new design is EMIB, a small intelligent bridge that allows heterogeneous silicon to quickly pass information in extremely close proximity. EMIB eliminates height impact as well as manufacturing and design complexities, enabling faster, more powerful and more efficient products in smaller sizes. This is the first consumer product that takes advantage of EMIB.
Intel has also developed unique software drivers and interfaces for the discrete GPU to coordinate information among all package elements, managing temperature and power delivery along with allowing system designers to optimize the power sharing between processor and graphics for specific tasks like performance gaming.
Through this collaboration, Intel and AMD are aiming to create a chip that will enable thinner, lighter, more powerful mobile devices through a better combination of performance-level processors and discrete graphics in a smaller form factor. The end goal is to create laptops that are thin and portable, but still powerful enough to handle serious gaming and other GPU intensive tasks.
The partnership will allow AMD and Intel to better compete with Nvidia in the high-end laptop/compact desktop market.
There are, however, still a lot of unknowns about the chip, and Intel says more information will be available in the future. The first machines that use the new technology will be released in the first quarter of 2018.
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